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- CircuitMedic CP140210AS Plated Thru Hole Pads Frame, .140"ID x .210"OD
CircuitMedic CP140210AS Plated Thru Hole Pads Frame, .140"ID x .210"OD
Product Description
Specifications:
| Backing Material: | Phenolic Butral Film |
| Base Material: | Copper Foil |
| Bonding Temperature: | 475°F |
| Bonding Time: | 30 sec. |
| Coating: | Bright Tin |
| Frame Size: | 2.25 x 1.5" |
| Lands Diameter: | 0.21" |
| Lead-Free Solder Compatible: | Yes |
| Peel Strength: | 8 lb./in. |
| Size: | .140"ID x .210"OD |
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