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- CircuitMedic CS040070AS Surface Mount Pad Frame, .040" x .070"
CircuitMedic CS040070AS Surface Mount Pad Frame, .040" x .070"
Product Description
Specifications:
| Backing Material: | Phenolic Butral Film Adhesive |
| Base Material: | Copper Foil |
| Bonding Temperature: | 475°F |
| Bonding Time: | 30 s |
| Frame Size: | 2.25 x 1.50" |
| Lead-Free Solder Compatible: | Yes |
| Pad Length: | 0.070" |
| Pad Width: | 0.040" |
| Peel Strength: | 8 lb./in. |
| Size: | .040" x .070" |
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